机读格式显示(MARC)

• 000 01705nam0 2200325 450

• 001 0001103213

• 005 20230315130900.0

• 010 __ |a 978-7-111-70953-4 |d CNY118.00

• 100 __ |a 20220915d2022 em y0chiy50 ea

• 101 1_ |a chi |c eng

• 102 __ |a CN |b 110000

• 105 __ |a a z 000yy

• 106 __ |a r

• 200 1_ |a 宽禁带半导体器件耐高温连接材料、工艺及可靠性 |A Kuan Jin Dai Ban Dao Ti Qi Jian Nai Gao Wen Lian Jie Cai Liao、Gong Yi Ji Ke Kao Xing |9 kuan jin dai ban dao ti qi jian nai gao wen lian jie cai liao、gong yi ji ke kao xing |b 专著 |f (马来)萧景雄(Kim S. Siow)主编 |g 闫海东，吴义伯，杨道国译

• 210 __ |a 北京 |c 机械工业出版社 |d 2022

• 215 __ |a 16,232页 |c 图 |d 24cm

• 225 1_ |a 半导体与集成电路关键技术丛书 |A Ban Dao Ti Yu Ji Cheng Dian Lu Guan Jian Ji Shu Cong Shu

• 300 __ |a IC工程师精英课堂 机工电子

• 312 __ |a 版权页英文题名：Die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment, and reliability

• 330 __ |a 本书介绍了当前用于高温环境下的芯片连接所涉及的新型互连材料的理论基础、工艺方法、失效机制、工艺设备、质量控制与可靠性。

• 510 1_ |a Die-attach materials for high temperature applications in microelectronics packaging |e materials, processes, equipment, and reliability |z eng

• 606 0_ |a 禁带 |A Jin Dai |x 半导体材料

• 690 __ |a TN304 |v 5

• 701 _0 |c (马来) |a 萧景雄 |A Xiao Jing Xiong |9 xiao jing xiong |c (Siow, Kim S.) |4 主编

• 702 _0 |a 闫海东 |A Yan Hai Dong |9 yan hai dong |f (1981-) |4 译

• 702 _0 |a 吴义伯 |A Wu Yi Bo |9 wu yi bo |f (1979-) |4 译

• 702 _0 |a 杨道国 |A Yang Dao Guo |9 yang dao guo |c (半导体技术) |4 译

• 801 _0 |a CN |b OLCC |c 20221014

• 801 _2 |a CN |b Wuxilib |c 20230314

• 905 __ |a Wuxilib |d TN304/20